The global 3D IC and 2.5D IC packaging market is witnessing significant growth as semiconductor manufacturers increasingly adopt advanced packaging technologies to support artificial intelligence workloads, high-performance computing, automotive electronics, and next-generation consumer devices. Rising demand for AI accelerators, high-bandwidth memory (HBM), and compact high-performance...

The global packaging industry is rapidly transitioning toward sustainable materials, with mycelium-based packaging emerging as a promising alternative to plastic and polystyrene. Derived from fungal roots and agricultural waste, this innovative material is gaining traction across industries seeking biodegradable, low-carbon packaging solutions. According to the latest market analysis,...